TSMC to win more than $5 billion in grants for a US chip plant, Bloomberg reports

(Reuters) – Taiwan Semiconductor Manufacturing Co, the world’s largest contract chipmaker, is set to win more than $5 billion in federal grants from the United States government for setting up a chipmaking plant in the country, Bloomberg News reported on Friday.

(Reporting by Arsheeya Bajwa in Bengaluru; Editing by Shailesh Kuber)